Product Overview

The General Electric IC694MDL660 is a high-density 24 VDC discrete input module for PACSystems RX3i control architectures. It provides 32 input points in a compact footprint to acquire on/off field signals from sensors, switches, and contact outputs. The module is organized into isolated input groups to improve noise immunity and simplify field wiring in multi-circuit panels.

For commissioning and maintenance, each input channel has a dedicated status indicator, allowing fast verification of field device state without external test equipment. Configurable input filtering supports reliable operation in electrically noisy environments and helps prevent false input transitions caused by contact bounce or transient interference.

Electrical and Hardware Characteristics

• Model / Order Number: IC694MDL660

• Product Family: PACSystems (RX3i / IC694)

• Product Type: 24VDC Discrete Input Module

• Input Count: 32 points

• Grouping: 4 isolated groups, 8 points per group

• Nominal Input Voltage: 24 VDC

• Input Voltage Range: 0 to 30 VDC

• Input Current: 7.0 mA per point at rated voltage

• Logic Thresholds:

• ON state: 11.5 to 30 VDC

• OFF state: 0 to 5 VDC

• Group-to-Group Isolation: 250 VAC continuous (typical)

• Input Filtering: 7 selectable filter times, 0.5 ms to 100 ms (affects ON/OFF response time)

• Terminal Block Requirement: High-density terminal blocks IC694TBB032 or IC694TBS032

• Diagnostics: Individual channel LEDs for real-time input status

• Backplane/Module Consumption: Approximately 300 mA (module plus energized inputs, typical)

• CPU/Platform Compatibility: PACSystems RX3i CPU required; not intended for Series 90-30 CPUs

• Condition: Brand New, In Stock, Active

• Origin: USA

• Weight: 0.36 kg

• Dimensions: 3.5 × 13 × 13.5 cm

• HS Code: 8537101190

• MOQ: 1

Industrial Applications

• High-point-count 24 VDC signal collection in compact control cabinets

• Monitoring proximity sensors, photoelectric sensors, limit switches, and pushbuttons

• Reading auxiliary contacts from relays, starters, and interposing interface devices

• Packaging, material handling, automotive, and general manufacturing automation

• Retrofit I/O expansion in PACSystems RX3i installations where wiring density is critical