ABB Robotics and NAMTECH Launch Robotics School in India
MaxWell

ABB Robotics and NAMTECH Launch Robotics School in India

ABB Robotics and NAMTECH have partnered to establish a new School of Robotics in India focused on developing advanced automation and robotics skills for the country’s growing industrial sector.

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Pilz Launches IndustrialPI for IIoT and Soft PLC Applications
MaxWell

Pilz Launches IndustrialPI for IIoT and Soft PLC Applications

Pilz has introduced the IndustrialPI, a modular industrial PC based on Raspberry Pi architecture designed for IIoT gateway, soft PLC, and industrial data collection applications. The platform combines open-source flexibility with industrial-grade reliability for...

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Belden Launches LioN-Safety I/O Modules for Smarter Functional Safety
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Belden Launches LioN-Safety I/O Modules for Smarter Functional Safety

Belden has introduced its new LioN-Safety I/O modules, designed to simplify functional safety integration while improving communication between safety and non-safety automation systems in industrial environments.

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Beckhoff Launches TwinCAT PLC++ for Faster PC-Based Automation
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Beckhoff Launches TwinCAT PLC++ for Faster PC-Based Automation

Beckhoff Automation has introduced TwinCAT PLC++, a next-generation PLC platform designed to deliver faster runtime performance, simplified engineering workflows, and stronger integration between industrial automation and modern IT development environments.

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Turck Introduces Smart IP67 Power Supplies With IO-Link Diagnostics
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Turck Introduces Smart IP67 Power Supplies With IO-Link Diagnostics

Turck has expanded its industrial power portfolio with new IP67-rated smart power supplies featuring IO-Link communication, remote diagnostics, and electronic fuse functionality designed for modern automated manufacturing environments.

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Banner Highlights Smart Sensing and Safety Solutions at PACK EXPO
MaxWell

Banner Highlights Smart Sensing and Safety Solutions at PACK EXPO

Banner Engineering showcased its latest industrial sensors, machine safety systems, and visual signaling technologies at PACK EXPO, focusing on high-speed packaging applications that demand greater accuracy, durability, and operational reliability.

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