Emerson Unveils Floor-to-Cloud Digital Architecture at PACK EXPO
At PACK EXPO 2025, Emerson showcased a definitive vision for packaging automation by bridging the gap between raw shop-floor telemetry and high-level enterprise analytics.
Siemens and OnLogic Extend Industrial Edge Computing to Harsh Environments with AI and Legacy Integration
The convergence of operational technology and information technology often stops at the edge of harsh operating environments. To bridge this gap, Siemens and OnLogic have formed a strategic partnership to extend the Siemens Industrial...
Redefining the Industrial Interface: Moving Beyond the Touchscreen to Multi-Layer Automation
The definition of the human-machine interface (HMI) is evolving far beyond the traditional 7-to-21-inch touchscreen mounted in a control cabinet. As industrial facilities integrate advanced machine learning and AI automation into their architectures, the...