{"product_id":"hiee300867r0001-ppb022-de-abb-processor-board-ac-800pec-series","title":"HIEE300867R0001 PPB022 DE ABB Processor Board AC 800PEC Series","description":"\u003cp\u003eThe \u003cstrong\u003eABB HIEE300867R0001 PPB022 DE\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003ePPB022 DE\u003c\/strong\u003e Processor Board, operates as a dedicated hardware component for application logic execution and bus signal processing within System 800xA and Symphony Harmony\/Plus platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Identification \u0026amp; Subsystem Architecture\u003c\/h3\u003e\n\u003cp\u003eThe hardware part number and board classification designate functional attributes within the controller subrack:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHIEE300867R0001\u003c\/strong\u003e: OEM part number designating the specific PCB hardware assembly.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePPB022 DE\u003c\/strong\u003e: Circuit board type code identifying the processor execution board variant.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAC 800PEC \/ 800xA\u003c\/strong\u003e: DCS controller infrastructure supported by the processor board hardware interface.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical \u0026amp; Operating Specifications\u003c\/h3\u003e\n\u003cfigure\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eHIEE300867R0001 PPB022 DE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eABB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eSweden\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.85 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShipping Dimensions\u003c\/td\u003e\n\u003ctd\u003e4.0 cm x 19.8 cm x 26.2 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e\u0026lt;= 15 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupply Voltage\u003c\/td\u003e\n\u003ctd\u003e24 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCurrent Draw\u003c\/td\u003e\n\u003ctd\u003e\u0026lt;= 0.65 A @ 24 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInrush Current\u003c\/td\u003e\n\u003ctd\u003e\u0026lt; 3 A for 100 ms\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrical Isolation\u003c\/td\u003e\n\u003ctd\u003e500 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Humidity\u003c\/td\u003e\n\u003ctd\u003e5 to 95 % RH, non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOn-Board Memory\u003c\/td\u003e\n\u003ctd\u003e18 MB Flash PROM for firmware storage\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eApplication Capacity\u003c\/td\u003e\n\u003ctd\u003eUp to 32 applications and 32 tasks per controller\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Execution \u0026amp; System Bus Interface\u003c\/h3\u003e\n\u003cp\u003eThe processor board maintains high backplane bus communication velocity by executing logic routines in dedicated timing cycles. System memory architectures allow firmware flash compatibility across controllers while maintaining isolation boundaries. Dual bus interfaces distribute control tasks and maintain determinism across cyclic I\/O scanning phases.\u003c\/p\u003e\n\u003ch3\u003ePacking List \u0026amp; Supply Content\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e1 x ABB HIEE300867R0001 PPB022 DE Processor Board\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eInstallation \u0026amp; Static Safety Procedures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAnti-Static Measures\u003c\/strong\u003e: Always wear a grounded ESD wrist strap connected to cabinet earth before handling or inserting the circuit board.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower Disconnection\u003c\/strong\u003e: Verify 24 VDC power is isolated at the subrack terminal strip prior to plugging the board into the backplane connectors.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCable Seating\u003c\/strong\u003e: Ensure all ribbon cables and multi-pin bus connectors align correctly with guide pins and seat completely into socket latches.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConduit Routing\u003c\/strong\u003e: Maintain physical separation between 24 VDC power supply wiring and external high-voltage process connections inside the cabinet.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWhat is the input voltage rating for the HIEE300867R0001 processor board?\u003c\/p\u003e\n\u003cp\u003eThe board requires a nominal supply voltage of 24 VDC, drawing less than 0.65 A during normal processing operations.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eWhat inrush current should be calculated for power supply sizing?\u003c\/p\u003e\n\u003cp\u003eThe board draws an inrush current of less than 3 A for a duration of 100 ms during initial 24 VDC power application.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHow much firmware flash memory is integrated on the board assembly?\u003c\/p\u003e\n\u003cp\u003eThe board contains 18 MB of onboard Flash PROM allocated for firmware image storage and execution parameters.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eWhat is the electrical isolation rating between board circuits and ground?\u003c\/p\u003e\n\u003cp\u003eGalvanic isolation is rated at 500 VDC between the internal logic circuitry and the chassis ground interface.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eCan the processor board be hot-swapped while the rack is fully energized?\u003c\/p\u003e\n\u003cp\u003eNo, input 24 VDC power to the controller rack section must be isolated before board insertion or removal to prevent component damage.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHow many control tasks can be executed simultaneously on this hardware platform?\u003c\/p\u003e\n\u003cp\u003eThe processing architecture supports configuration for up to 32 concurrent applications and 32 execution tasks.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eWhat storage temperature limits apply to this hardware during transit?\u003c\/p\u003e\n\u003cp\u003eThe board is rated for storage temperatures ranging from -25 deg C to +70 deg C in non-condensing environments.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eWhat procedure ensures proper cable seating during replacement?\u003c\/p\u003e\n\u003cp\u003eInspect all ribbon cable connectors for bent pins and press multi-pin headers down until retainers latch fully into place.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"ABB","offers":[{"title":"Default Title","offer_id":46021044043949,"sku":"HIEE300867R0001 PPB022 DE","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0733\/1613\/9181\/files\/1MRK001608-CAr02_4.jpg?v=1788323251","url":"https:\/\/www.maxwellplc.com\/products\/hiee300867r0001-ppb022-de-abb-processor-board-ac-800pec-series","provider":"Maxwell PLC Ltd","version":"1.0","type":"link"}