{"product_id":"086364-001-abb-digital-input-module-pc-board-assembly","title":"086364-001 ABB Digital Input Module PC Board Assembly","description":"\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eABB 086364-001\u003c\/strong\u003e, also cataloged as the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003e086364\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eDigital Input Module, serves as the primary\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003e086364\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eDigital Input Module utilized to execute discrete field signal acquisition and state monitoring across ABB processor platforms. The printed circuit board assembly acts as a multi-channel sensor module, converting external binary electrical status indicators from field contacts into logic-level data registry entries over the local subsystem rack.\u003c\/p\u003e\n\u003ch3\u003eModule Configuration Architecture\u003c\/h3\u003e\n\u003cp\u003eThe manufacturing design parameters establish the physical and structural profile for the assembly:\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003e086364-001\u003c\/strong\u003e: Main factory assembly classification index with integrated logic components.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003e086364001\u003c\/strong\u003e: Compressed product numbering sequence representing an identical electrical component layout.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical Specification Matrix\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eModel\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e086364-001\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eBrand\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eABB\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eOrigin\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eUnited States\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eWeight\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0.14 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eShipping Dimensions\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e12.6 cm x 8.9 cm x 4.6 cm\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eOperating Temp\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0 deg C to +60 deg C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003ePower Consumption\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMinimal voltage draw from backend bus infrastructure\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eModule Category\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eDiscrete PC Board Assembly \/ Sensor Module\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003eInput Processing\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMulti-channel digital input state registration\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe sensor module is dependent on fixed backplane bus communication velocity allocations to prevent data collisions when updating the controller logic image table. Proper alignment of parallel processing tracks balances the overall local I\/O density scaling profiles, ensuring that transient voltage spikes on high-density switching groups do not affect neighboring registers. System configurations must adhere to specific firmware flash compatibility benchmarks across the rack network to preserve correct channel debounce metrics and timing verification loops.\u003c\/p\u003e\n\u003ch3\u003eEngineering Support Log\u003c\/h3\u003e\n\u003cp\u003eQ: Can this sensor module be removed under active backplane power?\u003c\/p\u003e\n\u003cp\u003eA: No, live hot-swap execution is prohibited by the electrical properties of this printed circuit board assembly. The housing frame must be completely de-energized to prevent logic gate corruption.\u003c\/p\u003e\n\u003cp\u003eQ: How is signal bouncing from field contacts minimized on the board input channels?\u003c\/p\u003e\n\u003cp\u003eA: Onboard hardware RC filter networks process incoming binary lines, applying mechanical contact debounce delays before passing the logic states to the backplane bus interface.\u003c\/p\u003e\n\u003cp\u003eQ: What indication monitors internal loop and input branch failures?\u003c\/p\u003e\n\u003cp\u003eA: Individual status registering channels communicate directly with the diagnostic logs of the main processor, generating channel fault flags if communication link velocity drops below specified boundaries.\u003c\/p\u003e\n\u003ch3\u003eField Assembly and Wiring Directives\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003eSlide the bare printed circuit board assembly carefully along the chassis guide rails to avoid scoring the outer trace layers.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eIsolate field signal wiring groups from heavy current inductive motor lines inside the structural routing pathways.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGround the primary terminal block mounting frameworks to the common enclosure ground bar using low-impedance copper conductors.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUse appropriate shielding methods on external binary input runs to neutralize transient electrostatic coupling.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePackage Component Manifest\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003eABB 086364-001 Digital Input Sensor Card\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFactory Inspection and Trace Continuity Certificate\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eShipping and Freight Logistics\u003c\/h3\u003e\n\u003cp\u003eDelivery time: 2-7 days when payment finish, with international distribution managed through premium carriers DHL, FEDEX, or UPS. The components are secured inside sealed anti-static industrial packaging pouches lined with specialized high-density static-dissipative foam inserts to maintain complete mechanical insulation throughout international shipment.\u003c\/p\u003e","brand":"ABB","offers":[{"title":"Default Title","offer_id":46021162074285,"sku":"086364-001","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0733\/1613\/9181\/files\/086364-001_1.jpg?v=1779688991","url":"https:\/\/www.maxwellplc.com\/products\/086364-001-abb-digital-input-module-pc-board-assembly","provider":"Maxwell PLC Ltd","version":"1.0","type":"link"}